The Phantom III RIE system is designed to supply research and failure analysis laboratories with state-of the-art plasma etch capability using single wafers, dies or parts.
The RIE (reactive ion etch) system has up to seven process gases, which are used to etch nitrides, oxides and any films or substrates requiring fluorine-based chemistries. This reactor can also be used to strip photoresist and other organic materials. An electrostatic chuck (E-chuck) is offered as an option to more effectively keep the wafer cool during the etch process. This E-chuck uses a helium pressure controller to build up a cooling layer of helium on the backside of the wafer.