The MA6 UV optics allows full field exposure of a whole wafer and optimized for steep wall slopes and high resolution. Diffraction effects are minimized with a discrete number of illumination angles smoothing printed features. Depending on the optical wavelength and desired printing method (soft, hard, or vacuum contact and proximity) micron resolutions can be achieved. Motorized wafer and top mounted microscope provide reliable ±0.5 µm mask alignment. The wavelength of UV is 365 nm.
A photolithography spin coating and development station couples the mask aligner.
Currently, there are SU-8 (negative) and S1818 (positive) photoresists in the cleanroom.
The external user fee is $600/sample.