The MA6 UV optics allows full field exposure of a whole wafer and optimized for steep wall slopes and high resolution. Diffraction effects are minimized with a discrete number of illumination angles smoothing printed features. Depending on the optical wavelength and desired printing method (soft, hard, or vacuum contact and proximity) micron resolutions can be achieved. Motorized wafer and top mounted microscope provide reliable ±0.5 µm mask alignment. The wavelength of UV is 365 nm.
A photolithography spin coating and development station couples the mask aligner.
Currently, there are SU-8 (negative) and S1818 (positive) photoresists in the cleanroom.
The external user fee is $600/sample.
The MJB 3 is designed for high resolution photolithography in a laboratory or pilot plant production. It offers flexibility in handling of irregularly shaped substrates of differing thickness as well as standard sized substrates up to 3” diameter.
Resonetics RapidX 250 Excimer System is a standard laser workstation designed to be a flexible, general-purpose workstation. The system is designed to meet a variety of laser micro-machining applications involving a wide palette of materials, including silicon, plastics, ceramics, glass, sapphire, other inorganic materials, and metals.
The Laser Micro-machining is defined as a fabrication technique to drill, skive, strip, mill, cut plastics, ceramics, glass and thin metals with dimensions and tolerances approaching 1 micron (0.00004″). Laser micro-machining is performed by two different methods: mask projection and direct-write. This technique could be applied to the following areas:
1) medical device components and assembly manufacturing;
2) semiconductor OEM components manufacturing;
3) flexible circuits manufacturing;
4) industrial components manufacturing.
For wafer inspection.
The spin processor housing has been machined from solid virgin grade materials which do not degrade or generate particles. The bowl-shaped interior forces fluid downward where it is routed directly to the rear drain. The upper plenum closes inside the base providing an overlapping seal. A proprietary motor seal protects the motor and control electronics from chemical contamination. This unique seal has proven to be sub-micron particle-free during field testing. Nitrogen purged process chamber is standard.
OPERATION: After a substrate is loaded on to the chuck, vacuum hold-down is engaged from the side mounted control panel and the lid closed, a preprogrammed process is selected and then initiated by only a few keystrokes. Note: Many other vacuum as well as non-vacuum chucks are available some of which automatically center the wafer and allow for back-side processing.
The hot plate is mainly used to bake photoresist. Operation parameters include a 50-350°C range with a 1°C resolution and can hold wafers up to 6 inches (15.24 cm) in diameter. This hot plate is dedicated to lithography process and is not allowed for other uses.